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- Strategize and Lead Low-Power Design Initiatives :
- Define and execute strategies for achieving low-power, high-performance physical design. Lead the development of innovative workflows and methodologies to minimize power consumption while ensuring design reliability and scalability.
- Oversee Full-Chip Floor Planning and Routing :
- Provide technical leadership in full-chip floor planning and place-and-route activities. Optimize chip area, performance, and power metrics, while mentoring junior engineers in advanced methodologies.
- Architect Power Distribution Networks :
- Design and validate robust power networks to meet demanding performance criteria. Conduct power integrity analysis to address IR drop, noise, and power grid optimization, ensuring alignment with low-power objectives.
- Drive Timing Closure and Integrity Signoff :
- Lead timing closure efforts across cross-functional teams. Address complex timing violations, optimize critical paths, and ensure successful power and signal integrity signoff for final design verification.
- Champion Physical Verification Processes :
- Oversee DRC and LVS verification, resolving escalated issues and ensuring designs comply with layout and manufacturing rules. Guide the team through pre-tape-out readiness.
- Act as a key liaison among RTL, analog, and verification teams. Drive alignment between physical design and overall architecture while addressing challenges and providing technical guidance to stakeholders.
- Champion the adoption of emerging tools, techniques, and methodologies. Drive workflow innovations to enhance efficiency, scalability, and quality of low-power physical design.
Requirements :
Educational Background :Bachelor’s degree in Electronics, Computer Science, Electrical Engineering, or a related field. Master’s or Ph.D. preferred.Experience :10+ years in physical design with expertise in high-performance, low-power semiconductor technologies (12nm and below). Proven tape-out success and leadership experience are essential.Advanced Technical Expertise :Deep expertise in full-chip floor planning, place-and-route, and physical verification (DRC and LVS). Advanced knowledge of power network architecture, IR drop, and noise analysis. Strong proficiency with timing closure processes and STA tools like PrimeTime.Software and Tools Proficiency :Extensive experience with industry-standard tools such as Synopsys IC Compiler, Cadence Innovus, and scripting languages like Perl, TCL, and Python.Expert-level experience in advanced place-and-route strategies for performance and power optimization.Leadership and Mentorship :Proven ability to lead teams, mentor junior engineers, and manage cross-disciplinary collaboration in a fast-paced environment.Preferred Expertise :Experience in deep sub-micron technologies (7nm, 5nm, etc.), multi-voltage designs, advanced low-power techniques, and design-for-manufacturing (DFM). Familiarity with emerging semiconductor trends is a strong advantage.Seniority level
Seniority level
Mid-Senior level
Employment type
Employment type
Full-time
Job function
Industries
Semiconductor Manufacturing
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