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Lead Process Engineer - CPO & Testing
TAURUS FIRM PTE. LTD.Singapore4 days ago
Job descriptionDegree / Master / PhD's in Electrical / Electronics Engineering 5 years experience in semiconductor assembly processes Strong knowledge in flip-chip, wirebond, die attach, FAU-to-PIC coupling Familiarity with epoxy materials, optical alignment, and bonding techniques Advantage : 3D printing experience of polymer / resin-material Strong analytical, hands-on, and cross-functional collaboration skills
Lead Process Engineer - CPO & Testing
Overview :
Contribute to advanced packaging R&D for Co-Packaged Optics (CPO), collaborating with global teams. The role involves hands-on process development, optical alignment, tooling design, and machine optimization to drive yield improvements and technical innovation in Fiber Array Unit (FAU) attachment.
Key Responsibilities :
- Lead FAU attach process development (passive / active alignment, epoxy dispensing, bonding, curing)
- Operate and maintain sub-micron active alignment machines
- Perform root-cause analysis, yield improvement, and data collection
- Design new pickup tools, fixtures, and test jigs for optical assemblies
- Work with vendors to enhance machine performance for CPO projects
- Draft FMEA, process control specs, and coupling loss test procedures
Requirements :
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Lead Engineer • Singapore