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Laser-Assisted Bonder process engineer | Semicon | LAB - THE SUPREME HR ADVISORY PTE. LTD.

THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG

1 day ago

Job description

Roles & Responsibilities

Position title : Laser-Assisted Bonder (LAB) process engineer

Location : Admiralty

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends experience)

Interested applicants can also send your resume to WA : +65 8839 3566 (Ms Angel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

LIEW ONN KEE REG NO : R22108518

THE SUPREME HR ADVISORY EA NO : 14C7279

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

Process Development & Optimization : Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
Scale-Up & Qualification : Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
Equipment & Program Management : Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
Troubleshooting & Support : Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Continuous Improvement : Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Documentation : Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
Cross-Functional Collaboration : Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Safety & Compliance : Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
Customer & Project Support : Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
Laser Maintenance & Calibration (Good-to-have) : Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.

Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

Familiarity with advanced process control and manufacturing best practices

Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

Knowledge of bonding process and materials behaviour under thermal / mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Tell employers what skills you have

Recipes

Materials Science

FMEA

Stress

Technology Transfer

Throughput

Program Management

Technical Training

KEE

SPC

PFMEA

Six Sigma

Calibration

Advanced Process Control

Minitab

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Engineer Semicon Lab • D01 Cecil, Marina, People’s Park, Raffles Place, SG