Roles & Responsibilities
We are looking for a Sr Manager / Manager to join our Advanced Packaging Technology Development (APTD) team!
Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects.
Key responsibilities and duties include :
Develop and Communicate Advanced Packaging Technology Development Strategy
- Develop and communicate Advanced Packaging Technology Development strategic objectives
- Understand the impact and implications of APTD strategy to the overall company strategy and direction
Technical Leadership
Set fiscal year technical objectives and insure they are aligned with department objectivesDemonstrate understanding of technology complexity and effective technology decision makingProvide technical leadership that may influence company directionMulti-Functional Leadership
Represent APTD in providing cross department leadership in area of responsibilityWork effectively with peers in other department to develop and drive multi-functional initiativesImpact and Execution
Ensure accuracy, quality, and timeliness of resultsGuide best utilization of resources to achieve end resultsEnsure critical work, milestones and goals are met by the teamGrowth Mindset
Continue to build new skills through development goals and learning events.Seek out opportunities to work multi-functionally, build a network, and gain competency across domainsTraining and Development :
Conduct performance appraisals with team members to create goals and development plansMentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technologyRequirements
B.S / M.S. / Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging fieldProficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.Experience with Visual Basic for automation and tool integration.Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactionsStrong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliabilityConsistent track record to solve problems and address root causesAbility to multi-task and manage numerous projects simultaneouslyTenacity to work effectively under timelines and limited resourcesTell employers what skills you have
Ability to Multitask
Materials Science
Modeling
Appraisals
Technology Development
Physics
Visual Basic
Packaging
SPC
Food Science
Technical Leadership
Assembly
Process Control
Chemical Engineering
Mechanical Engineering
Organizational Leadership
