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Advanced Packaging Process Integration Principal / Staff Engineer - D17 Loyang, Changi, SG

Advanced Packaging Process Integration Principal / Staff Engineer - D17 Loyang, Changi, SG

APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.D17 Loyang, Changi, SG
14 hours ago
Job description

Roles & Responsibilities

Job Description

As a Process Integration Principal / Staff Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities :

  • Develop 2.5D / 3D process technologies and solutions for Advanced Packaging including Bump / Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
  • Plan wafer splits / lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
  • Process and manage wafers / lots through integrated lines / process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
  • Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
  • Owns, manage, and drive technical programs / project, report out timely status and interface with various stakeholders / management leading to completion.

Experience :

  • Around 10 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either : Front-end of Line / Back-end of Line / Packaging or Assembly.
  • Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
  • Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
  • Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
  • Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
  • Demonstrate ability, experience, and good communication skills to work across different functions / unit process owners and geographies to achieve technical outcome.
  • Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.
  • Work Location :

  • Science Park II
  • Tell employers what skills you have

    Materials Science

    Data Analysis

    Process Integration

    Physics

    3D

    Reliability

    Research and Development

    Chemistry

    Good Communication Skills

    Packaging

    Grinding

    Molding

    Metrology

    Assembly

    Completions

    PVD

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    Principal • D17 Loyang, Changi, SG

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