Principal / Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Roles & Responsibilities

Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing : using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include :

Process Development :

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Establish and improve process management projects to deliver technology node requirements

Equipment and Materials :

Quality Improvement :

Collaboration and Coordination :

Requirements

Tell employers what skills you have

Materials Science

Technology Development

Quality Improvement

Defense

Physics

Manufacturing Processes

Artificial Intelligence

Product Engineering

Fabrication

Visual Basic

Process Management

SPC

Assembly Processes

Assembly

Process Control

Chemical Engineering