Roles & Responsibilities
Responsibilities :
- Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
- Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
- Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
- Initiates team discussion / review on customer document gaps / discrepancies and recommend proposals to customer
- Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
- Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
- Develop and grow people project management skills, adopting on dynamic changes and crisis management
- Drive for productivity improvement and cost reduction in process integration
- Work with TPM / Sales / customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue
Requirements :
Degree / Diploma in Electrical / Electronics, Engineering or equivalentMinimum 3 years of Engineering experience in Semiconductor manufacturing industryPreferably with Project Management CertificationKnowledge of how bumping, assembly material interact with package workmanship and reliability would be preferredKnowledge on WLCSP bumping process of 2P2M; DOE / SPC / FMEA / JMP / APQP standardBumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferredTell employers what skills you have
FMEA
Process Integration
Semiconductor Manufacturing
Productivity Improvement
APQP
Process Engineering
Project Management
new product introduction
Assembly
Manufacturing