Staff Packaging SI Engineer

Roles & Responsibilities

• Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,

• Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.

• Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN

• Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets

• Perform frequency and time domain lab measurements on silicon die, bare substrates, PCBs and systems, often using micro probe stations

• Contribute to the documentation of the simulation / extraction flows and Design Guidelines

• Interface with substrate and assembly suppliers through the packaging team, to help drive packaging technology improvement for electrical performance, such as 2.5D Integration and Substrates for high-speed applications

• MS in EE with 6+ years of experience or Ph.D. in EE with 3+ years of experience or BS in EE with 8+ years of experience in Signal Integrity / Power Integrity Analysis and Interconnect Design Optimization for Electrical Performance

• Solid knowledge in Interconnect Electromagnetics, Transmission Line Theory and Circuit Theory

• Power user of Ansys HFSS, Q3D, SIWave and/or Cadence Sigrity Power SI

• Power user of Ansys Designer, HSpice or Agilent ADS

• Working knowledge of Cadence APD and AutoCAD

• Hands-on lab measurement experience with VNA, TDR System & Oscilloscopes, preferably with micro-probe stations

• Strong communication, analytical and organizational skills; attention to details in engineering analysis and project management

Tell employers what skills you have

Signal Integrity
Analog
Electrical Design
Agilent ADS
HFSS
Electrical
Project Management
PCB
SoC
Packaging
PCB Design
Cadence
HSPICE
Engineering Analysis
Assembly
Life Sciences
IC
Silicon
VNA
ANSYS