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Senior Engineer - (Mechanical & Thermal Analysis)

UTAC groupSingapore

30+ days ago

Job description

Senior Engineer - (Mechanical & Thermal Analysis)

22 Ang Mo Kio Ind Park 2, Singapore 569506 Req #463 Wednesday, September 11, 2024

Please join us!

Roles & Responsibilities

Perform mechanical & thermal analysis and characterization of advanced IC packages
Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
Conduct IC packaging technology development together with other teams
Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation

Requirements

Degree / Master in Mechanical Engineering or related field

Solid knowledge on FEM & mechanics of material

Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must

Thermo-mechanical modeling experience for IC assembly molding process, die stress / shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable

Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable

Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable

Team player with good interpersonal and communication skills

Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis / design / optimization / characterization

22 Ang Mo Kio Ind Park 2, Singapore 569506

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