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Engineer, APTD CEM - Advanced Packaging Equipment Engineering - D27 Yishun, Sembawang, SG

Engineer, APTD CEM - Advanced Packaging Equipment Engineering - D27 Yishun, Sembawang, SG

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
17 hours ago
Job description

Roles & Responsibilities

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.

Key responsibilities and duties include :

Equipment Development :

  • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
  • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
  • Establish and improve equipment management projects to deliver technode requirements

Equipment Strategy :

  • Evaluate and promote new equipment and materials to enhance process capabilities
  • Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
  • Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability
  • Quality Improvement :

  • Ensure defense coverage through process, measurement, inspection, and testing
  • Establish correlations between defense mechanisms to identify improvement opportunities
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
  • Collaboration and Coordination :

  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including the Package Integration, PWF / Assembly Engineering, Front End Wafer Fab, Assembly / Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production
  • Job Requirements :

  • Bachelor’s or advanced degree in Engineering or Science is required
  • Strong analytical, logical, and critical thinking skills
  • Effective communicator, able to collaborate across all levels
  • Growth mindset with a passion for continuous learning
  • Internship or experience in the semiconductor industry is a plus
  • Demonstrated leadership and a track record of impact are highly desirable
  • Interest in and knowledge of the semiconductor industry and Micron is preferred
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
  • Experience with Visual Basic for automation and tool integration is preferred.
  • Embody Micron’s core values :

  • People – Respect, develop, and empower others
  • Innovation – Drive continuous improvement and breakthrough thinking
  • Tenacity – Show grit and determination
  • Collaboration – Build trust and foster teamwork
  • Customer Focus – Deliver excellence and value
  • What to Expect

    Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

    Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design / development engineering jobs.

    Tell employers what skills you have

    Sustainability

    Data Analysis

    Modeling

    Technology Development

    Process Capability

    Semiconductor Industry

    Manufacturing Processes

    Electrical

    Product Engineering

    Equipment Maintenance

    Visual Basic

    Packaging

    PCB Design

    Customer Focus

    Product Development

    Assembly

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    Engineer Equipment • D27 Yishun, Sembawang, SG

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