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Sr Manager / Manager, Advanced Packaging Integration Engineering - D27 Yishun, Sembawang, SG

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG

3 days ago

Job description

Roles & Responsibilities

Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing : using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for a Sr Manager / Manager to join our Advanced Packaging Technology Development (APTD) team!

You will lead the package integration department to enable deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects.

Key responsibilities and duties include :

Develop and Communicate Advanced Packaging Technology Development Strategy

Develop and communicate Advanced Packaging Technology Development strategic objectives
Understand the impact and implications of APTD strategy to the overall company strategy and direction

Technical Leadership

Set fiscal year technical objectives and insure they are aligned with department objectives

Demonstrate understanding of technology complexity and effective technology decision making

Provide technical leadership that may influence company direction

Multi-Functional Leadership

Represent APTD in providing cross department leadership in area of responsibility

Work effectively with peers in other department to develop and drive multi-functional initiatives

Impact and Execution

Ensure accuracy, quality, and timeliness of results

Guide best utilization of resources to achieve end results

Ensure critical work, milestones and goals are met by the team

Growth Mindset

Continue to build new skills through development goals and learning events.

Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Training and Development :

Conduct performance appraisals with team members to create goals and development plans

Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology

Requirements

B.S / M.S. / Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields

8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development

Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

Experience with Visual Basic for automation and tool integration.

Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions

Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

Consistent track record to solve problems and address root causes

Ability to multi-task and manage numerous projects simultaneously

Tenacity to work effectively under timelines and limited resources

Validated ability to lead small and large teams, directly or indirectly, toward common goals

Outstanding communication and presentation skills, written and verbal to all levels of an organization

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design / development engineering jobs.

Tell employers what skills you have

Materials Science

Appraisals

Hardware

Technology Development

Reliability

SQL

Visual Basic

Python

SPC

Presentation Skills

Technical Leadership

Manufacturing

Electrical Engineering

Chemical Engineering

Mechanical Engineering

Organizational Leadership

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Advanced Integration • D27 Yishun, Sembawang, SG