Back-end Packaging Design Engineer – Thermo-Compression Bonding (Semiconductor Industry) - YZ11 - D01 Cecil, Marina, People’s Park, Raffles Place, SG

Roles & Responsibilities

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location : Admiralty Street

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have :

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature / power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have :

Required Skills and Qualifications

Interested applicants, WA your resume to ‪‪‪‪+65 9136 9792‬‬‬‬ or email your resume to supreme.yentan@gmail.com.

TAN YEN ZHEN (CHEN YANZHEN) REG NO : R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO : 14C7279

Tell employers what skills you have

Compression

Materials Science

FMEA

Quality Management

Stress

Contamination Control

Throughput

3D

Fabrication

IP

Sensors

Simulations

Windchill

Assembly

CAD

Minitab