6723 - Laser-Assisted Interconnect Engineer | SemiconductorAssembly | Six Sigma, Process Scaling, EquipmentProgramming

Laser-Assisted Bonder (LAB) process

engineer

Location : Admiralty

Working Days : 5 Day A Week

Working

hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends

experience)

Overview

LAB Process Engineer is responsible for developing, optimizing, and

maintaining laser bonding processes-especially in high-precision,

high-reliability Advanced Packaging application for Chip-to-Wafer

or Chip-to-Substrate bonding.

Key

Responsibilities

Process Development & Optimization : Develop,

implement, and optimize laser-assisted bonding processes for

product packaging, advanced interconnects, or micro-assembly,

including recipe creation and parameter optimization to achieve

maximum yield, quality, and throughput.

Scale-Up & Qualification : Qualify new laser bonding

processes from R&D to high-volume production, working with both

development and production teams.

Equipment

& Program Management : Specify, program, and refine laser bonder

equipment and processes, ensuring the right hardware and software

configurations for various substrates and products.

Troubleshooting & Support : Troubleshoot laser systems

and bonding processes; analyze and resolve yield, quality, and

reliability issues in collaboration with operators and maintenance

teams.

Continuous Improvement : Lead

initiatives to improve yield, cycle time, and cost-using

data-driven methodologies such as SPC, DOE, and Six Sigma tools

(like PFMEA).

Documentation : Maintain accurate

records of process parameters, recipes, standard operating

procedures (SOPs), and results for compliance and technology

transfer.

Cross-Functional Collaboration : Work

• closely with R&D, operations, maintenance, and quality teams;

provide technical training and support for process implementation

and equipment operation.

Safety &

Compliance : Ensure adherence to laser safety regulations and best

practices in a laboratory or production environment.

Customer & Project Support : Provide technical

insights and support for customer programs, NPI (new product

introduction), and technology upgrades as needed

Laser Maintenance & Calibration (Good-to-have) :

Perform regular maintenance, alignment, and calibration of laser

bonder equipment to ensure optimal performance and process

reliability. Develop preventive maintenance schedules and conduct

root-cause analysis for equipment

issues.

Requirements

Bachelor's or Master's degree in Materials Science,

Mechanical Engineering, Electrical Engineering, or a related

field.

Minimum 2-5 years of hands-on

experience in design and development of equipment's or

semiconductor packaging or advanced interconnect

processes.

Experience with Laser Assisted

bonding technologies is highly preferred. Familiarity with laser or

optical systems is necessary.

Familiarity with

bonding equipment and analytical tools (X-ray, SAM, OM,

etc.)

Familiarity with advanced process

control and manufacturing best practices

Excellent trouble-shooting, risk analysis, FMEA, and

statistical analysis (JMP, Minitab).

Knowledge

of bonding process and materials behaviour under thermal / mechanical

stress (e.g., CTE mismatch, flux residue, underfill

cure).

Experience on HBM, COWOS, 2.5D,

Fluxless Bonding is a definite

plus

https : / / wa.me / 6596420989

WhatsApp :

(Han)

Email :

supreme.cc.han@gmail.com

Chaw

Chiaw Han, Reg

No : R22106723

The

Supreme HR Advisory Pte Ltd, EA No : 14c7279