Process Development Engineer (Dry Etch)

Roles & Responsibilities

• Opportunity to work on future‑generation process technologies
• Strong career progression pathways across R&D and HVM.

About Our Client

This is a global, top‑tier semiconductor manufacturer with long‑standing operations across R&D and high‑volume manufacturing in the world. The organization is known for pushing process technology forward while maintaining a stable business footprint and deep partnerships. Engineers here work in fabs and development lines, collaborate across cross‑functional, multi‑site teams, and see their work translate into high‑impact, widely deployed products. The culture values technical rigor, data‑driven decisions, and continuous learning, offering clear pathways for technical growth and leadership.

Job Description

• Develop, optimize, and characterize dry etch processes for complex structures across multiple layers (oxide, nitride, polysilicon, carbon, metals).
• Engineer profile control, selectivity, etch‑to‑film interactions, critical dimension (CD) stability, and across‑wafer uniformity.
• Conduct advanced DOE, SPC, and defect‑based investigations to tighten process windows and improve stability.
• Work on HAR etch, trench/contact etch, slit/wave/wiring cuts, hard‑mask patterning, and complex stacks.
• Evaluate plasma chemistry, ion/radical dynamics, RF tuning, and chamber conditions that influence profile consistency and line integrity.
• Own etch chambers through installation → qualification → release.
• Conduct chamber matching, hardware evaluation, seasoning strategy optimization, and new chemistry trials.
• Work closely with equipment suppliers on tool improvements, hardware upgrades, and module‑level enhancements.
• Partner with Process Integration, Metrology, Thin Film, Photo, and Wet Process teams to ensure seamless module alignment.
• Support silicon builds, early process flow validations, and transfer‑to‑manufacturing milestones.
• Provide direction for long‑term etch roadmap development.
• Mentor junior engineers, lead problem‑solving sessions, and drive collaborative learning.
• Represent the module in cross‑site technical alignment, reviews, and decision‑making forums.

The Successful Applicant

• Hands‑on experience with ICP, CCP, RIE, or advanced plasma etch systems used for semiconductor fabrication.
• Strong understanding of plasma chemistry, RF power control, ion directionality, polymer control, profile shape engineering, and etch uniformity.
• Familiarity with 300mm etch equipment from LAM, TEL, AMAT, or equivalent.
• Proficiency in DOE, SPC, FDC/ADC, root‑cause analysis, and process window exploration.
• Experience using CD‑SEM, XSEM, profilometry, OES endpoint systems, and inline metrology tools.
• Strong analytical thinking and structured problem‑solving.
• Excellent communication for cross‑functional alignment.
• Ability to manage multiple projects with high ownership.

What's on Offer

You can expect a high‑impact engineering environment with the opportunity to contribute to advanced semiconductor process development alongside experienced technical leaders. The position offers access to cutting‑edge tools, collaborative project work, and the ability to influence meaningful improvements within a core technology area. Engineers in this team benefit from a supportive growth framework, exposure to cross‑functional problem‑solving, and a pathway to expand both technical depth and organizational influence. Overall, it's an opportunity to work on challenging, forward‑looking technologies within a stable and globally recognized industry setting.

Contact

Timothy Huang (Lic No: R1980928/ EA no: 18S9099)

Quote job ref

JN-012026-6918416

Phone number

+65 6416 9863

Tell employers what skills you have

Hardware
RF
Dynamics
Process Integration
Physics
Root Cause Analysis
Chemistry
Tuning
SPC
Windows
Film
Assembly Processes
Metrology
Manufacturing
Silicon