Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Roles & Responsibilities

Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.

Key Responsibilities :

• Design compact mechanical housing to operate under 250°C ambient conditions.
• Ensure internal core temperature remains under 55°C during runtime.
• Select and integrate miniaturized components (compute, battery, sensors).
• Strip sensor casings and reassemble into a custom mount with thermal shielding.
• Perform heat simulation, thermal insulation, and shock-resistance design.
• Test hardware in specified sites and environments.

Job Requirements :

Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics

We regret to inform that only shortlisted candidates will be notified.

Tell employers what skills you have

Firefighting

Thermal Insulation

Hardware

Solidworks

Sensors

Robotics

CAD

Electronics

Mechanical Engineering

ANSYS