Introduction
Develop process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing
Your Role
- Driving the development (design and process) of new differentiated technologies such as RF devices, advanced sensors, advanced packaging, and niche products as added features.
- Encourage elegant solution through innovation and out-of-the-box data-driven approach to solve development issues.
- Execute the experimental splits to optimize the process margin and demonstrate the functionality and manufacturability of the new differentiated technologies
- Run DOE and design experimental split plans for various tape-outs / products
- Identify and resolve process integration issues and ET related problems
- Maintained a strong collaborative work with cross functional team for development and qualification of the new technology.
- Driving towards technology milestones releases for mass production.
- Shows mastery of many aspects within one technical discipline, with group-wide recognition as a senior member of a technical team.
- Initiative and creativity result in significant changes to existing processes and methods, leads development and implementation.
- Solves complex, novel and non-recurring problems.
- Contributing inventor on a few patents
- Contributes to conference or journal publications
Accountability
Works on small projects or on sets of tasks of large projects and assignments.Trains and guides others in the own work area on technical skills as needed; ability to break down information for internal and external customers in a systematic and communicable manner.Participates in and / or leads (project) teamsRelationship Focus
Limited and supervised contact at engineering level.Maintains awareness of industry trends.Actively engages with suppliers (demos, in-house work).Attends consortia technical reviews.Required Qualifications :
Bachelor's degree with 5 years' experience, master's with 3 years' experience or Ph.D. with 2 years' experience.Specialized knowledge, imaginative thinking and sophisticated analytical techniques.Strong understanding of RF / CMOS device physics and electrical characterizationFluent in English Language both written & verbal and good presentation skillsRequires a technical (University) degree. (Exceptions approved by local HR).Knowledge on wafer bonding, TOS, TOV, and hybrid wafer bonding will be a plus for this job positionKnowledge on silicon micro-fabrication processes such as Litho, Etch, PVD, etc will be an added advantageGood interpersonal skill, tactful, resourceful, possess initiative, good presentation skillsStrong analytical, presentation and problem-solving skills using statistical tools such as JMPAble to perform under face paced and challenging environment