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Research Engineer (Heterogeneous Integration), (IME) - A •STAR RESEARCH ENTITIES

Research Engineer (Heterogeneous Integration), (IME) - A •STAR RESEARCH ENTITIES

A •STAR RESEARCH ENTITIESD05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG
12 days ago
Job description

Roles & Responsibilities

About Us : The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D / 3D packaging, and co-packaged optics, essential for the next generation of heterogeneous chiplet integration. At IME, you'll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview : We are seeking a highly skilled and motivated Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Requirements :

  • Educational Background : Master's or Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
  • Experience : Hands-on experience in process development or packaging R&D. A proven track record in advanced packaging technologies will be an added advantage.

Key Responsibilities :

  • Innovative Process Development : Lead the design and development of advanced assembly processes, including 2.5D / 3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
  • Evaluation and Characterization : Plan, coordinate, and execute comprehensive evaluations of processes, equipment, and materials. Drive the development of new process qualifications and establish manufacturing guidelines.
  • Project Collaboration : Partner with project leaders to align on requirements and enhance capabilities to meet evolving project needs.
  • Intellectual Property and Reporting : Prepare detailed engineering reports and contribute to the development of new intellectual properties (IPs) and knowledge areas (KHs), strengthening the IP portfolio in heterogeneous integration.
  • Customer and Market Engagement : Engage with internal and external stakeholders to anticipate future demands and develop the capabilities required to address them.

    • Tell employers what skills you have

    Materials Science

    Physics

    Chemistry

    Characterization

    Intellectual Property

    IP

    Packaging

    Optics

    Assembly Processes

    Manufacturing

    Electrical Engineering

    Electronics

    Mechanical Engineering

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    Research Engineer • D05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG