Scientist (Multi Chiplet Heterogeneous Integration andHigh-Speed IO Designer), (SiP), IME

We are seeking a highly skilled Electrical Modeling, Applied Machine Learning engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), with a focus on applied machine learning in advanced package physical design, high speed circuit modeling, design technology co optimization or system technology co optimization and analysis, signal / power integrity. The successful candidate will play a crucial role in developing accelerating simulation and analysis technology towards design enablement of state-of-the-art advanced packaging.

Key Responsibilities :

• Develop performance models, feature engineering of Electrical / Thermal / Mechanical analysis of multi chiplet advanced packages
• Collaborate with cross-functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs
• Data wrangling, EDA format parsing, generating custom databases for specific electrical, thermal and mechanical domain.
• Perform benchmarking of various applicable AI / ML algorithm and Design of Experiments.
• Integrate the AI / ML solution within the design flow for training and inference, develop and maintain data pipeline.
• Participate in comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis
• Stay up to date with the latest advancements, improve existing models, develop new ones and propose new applicable architectures.

Required Qualifications :

Preferred Qualifications :