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Engineer, New Product Introduction - WaferTechnology

CONTINENTAL AUTOMOTIVE SINGAPORE PTE. LTD.Singapore

4 days ago

Job description

Job Description

The Principal / Senior Engineer for New Product Introduction - Wafer Technology is responsible for overseeing semiconductor technology development and implementation. This role demands exceptional technical expertise to ensure the successful transition of products from concept to mass production.

Lead NPI process from Concept to Mass Production at Foundry (especially BCD, RF-CMOS), ensure collaboration between design, engineering, and manufacturing teams to maximize semiconductor technology optimization.
Ensure compliance with design rules and specifications while planning and evaluating silicon characterization results.
Develop and implement robust qualification processes, including the establishment of wafer acceptance criteria and comprehensive testing protocols.
Lead yield improvement initiatives through in-depth analysis of test data and resolution of issues encountered during the NPI process.
Produce comprehensive reports detailing project status, potential risks, and key milestones; execute thorough risk assessments for foundry excursions and return material authorizations.
Implement and oversee sophisticated data exchange protocols between foundry, Outsourced Semiconductor Assembly and Test (OSAT) providers, and Continental to facilitate effective yield monitoring and quality control.
Drive continuous improvement in wafer technology processes, identifying opportunities for enhanced efficiency, cost reduction, and quality improvement.
Develop and maintain strong relationships with key suppliers and technology partners, staying abreast of industry trends and emerging technologies in semiconductor manufacturing.

Qualifications

Degree in Electronics / Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).

Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100 / 101).

Preferable with strong technical proficiency in wafer manufacturing, process integration and / or device engineering.

Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.

Strong problem-solving skills, results oriented and a quality-focused mindset.

Team player with proactive attitude, able to work independently and travel frequently.

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