Lead Research Engineer (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (SiP), IME

Roles & Responsibilities

We are seeking a highly skilled multi-physics modelling and Process Design Kit (PDK) development engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), will focus on converting 2.5D / 3D / 3.5D chiplet based System in Package design and integration needs into advanced packaging PDK interconnect models, advanced co-simulation frameworks and reference flows. The successful candidate will play a crucial role in developing accelerating simulation, analysis and modelling towards design enablement of state-of-the-art advanced packaging.

Key Responsibilities :

• Collaborate with cross-functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs and modelling requirements.
• Evaluate and develop accurate PDK components using classical methods, multi-physics methods such as reduced order models, and probabilistic methods using applicable AI / ML algorithms or PINN.
• Participate and perform benchmark and Design of Experiments using measured tapeout data from test package of 2.5D Interposer, 3D Hybrid Bonding or 3.5D packages.
• Investigate and expand use of AI / ML algorithms within the advanced package design flow. Perform comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis.
• Develop and maintain PDK including installation, Design Rule Manual, automation and reference flows

Required Qualifications :

Preferred Qualifications :

Tell employers what skills you have

Perl

Signal Integrity

Designer

Modeling

TCL

Scripting

Electrical

Circuit Design

System Design

Packaging

Python

Simulations

Signal Processing