THE SUPREME HR ADVISORY PTE. LTD. - TCB (Thermo Compression Bonding) Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG

2 days ago

Job description

Roles & Responsibilities

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location : North

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $5000 - $8000 (depends experience)

Interested applicants can also send your resume to WA : +65 8839 3566 (Ms Angel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

LIEW ONN KEE REG NO : R22108518

THE SUPREME HR ADVISORY EA NO : 14C7279

Responsibilities :

Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature / power controls).
Support NPI (New Product Introduction) and technology transfers from R&D to production.
Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
Maintain compliance with environmental, health, and safety standards.
Experience on HBM, COWOS, 2.5D is a definite plus
Experience on N2 Environment is added advantage

Requirements :

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.

Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Tell employers what skills you have

Compression

Materials Science

Data Analysis

Design of Experiments

Root Cause Analysis

Environmental Health

Reliability

Compliance

KEE

Packaging

SPC

Manufacturing

Electrical Engineering

Mechanical Engineering

Failure Analysis

The Supreme Advisory • D01 Cecil, Marina, People’s Park, Raffles Place, SG