Summary
To develop and optimize AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines, and to support customer and internal quality requirements.
Job
- Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes
- Operate and optimize 2D / 3D AOI systems and inspection parameters
- Configure AOI inspection algorithms for new product designs
- Set up process conditions and equipment configurations for new packages and production lines
- Optimize reflow parameters and temperature profiles
- Analyze solder / micro bump quality and implement improvements
- Conduct root cause analysis and implement corrective actions for process issues
- Support customer quality requirements through technical evaluation and documentation
- Supports mass production and quality control in the advanced semiconductor packaging process
- Contributes to defect reduction, process stability, and customer satisfaction
- Drives yield and reliability improvements in AOI and reflow process areas
Requirement :
Bachelor's degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)Minimum 3 years of experience in AOI or reflow process in semiconductor backendAbility to establish process conditions and optimize parametersStrong data analysis and problem-solving skillsProficient in writing technical documents and communicating in EnglishKnowledge of inspection or reflow / soldering principlesExperience in defect analysis and developing defect evaluation criteriaRequired experience with bump and RDL inspectionBasic understanding of thermal, electrical, and material behavior in reflow processesExperience in advanced packaging process such as 2.5D, fan-out and flip-chipFamiliarity with quality tools such as APQP, FMEA and 8D methodologyExperience in responding to customer quality requirements or certification auditsAbility to write technical documentation and communicate in EnglishHand-on experience with major AOI equipment(e.g., KLA, onto, Camtek)Collaborative experience in AOI image analysis and algorithm developmentExperience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids.Experience in quality and reliability evaluation related to reflow or soldering processesUnderstanding of associated assembly / joining processes (eg. Bonding, chip attach)All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job :
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore
Tel :
EA License Number : 02C4944
EA Personnel Reg nos R
Job ID : 5WV9W6W5