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R&D Scientist, Co-Packaged Optics (NSTIC), IME
A •STARSingapur14 days ago
Job descriptionPh.D in Engineering or Physics. Strong background in optical interconnect modeling. Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.) Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments. Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing. Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler). Proficiency with microscope-based alignment, metrology, and optical loss measurements. Strong communication, teamwork, and technical reporting skills.
Job Description :
- Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
- Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
- Design silicon and alternative-material lenses for optical I / Os in wafer-scale integration.
- Estimate optical losses between grating / edge couplers and fiber interfaces via lens structures.
- Design package level / wafer-level optical interconnects between GPU?GPU and GPU?memory for multi-chiplet heterogeneous integration packages.
- Develop passive fiber alignment structures and techniques for high-density optical coupling.
- Evaluate fiber array assemblies with CPO test vehicles.
- Generate package design and test plans to prototype and validate process flows.
- Characterize fabricated structures using optical testing and metrology tools.
- Propose innovative ideas to improve the state of the art in optical interconnects and testing.
Job Requirements :
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Scientist • Singapur