Design Engineer (Die Ejection Systems) | TCB (Thermo Compression Bonding) | Thin Die & CoW Packages | Oxygen & Environmental Control Systems | Up to 8k | Admiralty - 4769 -

Roles & Responsibilities

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location : 8 Admiralty Stree

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

• Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
• Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
• Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
• Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
• Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
• Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
• Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
• Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
• Analyze yield loss due to ejection-related defects and implement design or process improvements.
• Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

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Tell employers what skills you have

Compression

Thermal Analysis

Contamination Control

3D

Chemistry

Vacuum Systems

Packaging

Sensors

CAD

Commissioning

Environmental Control

Mechanical Engineering

Calibration

ANSYS