MTS Integration & Yield, Advanced Packaging

Roles & Responsibilities

Introduction

We are seeking an experienced and highly motivated MTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.

Responsibilities :

• Lead Integration Activities : Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
• Technical Expertise : Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.
• Project Management : Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.
• Process Development : Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.
• Quality Assurance : Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
• Collaboration : Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.
• Documentation : Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
• Problem Solving : Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.
• Training and Mentorship : Mentor junior engineers and technicians, providing guidance and support in their professional development.
• Compliance : Ensure all packaging processes comply with industry standards and regulatory requirements.

Qualifications

Tell employers what skills you have

Technical Documentation

Materials Science

Quality Control

Quality Assurance

Thermal Management

Reliability

Mentorship

Adaptability

Packaging

Pressure

Regulatory Requirements

Electrical Engineering

Mechanical Engineering