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Senior Scientist (PECVD Module for Advance Packaging) (APM), IME - A •STAR RESEARCH ENTITIES
A •STAR RESEARCH ENTITIESD05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG1 day ago
Job descriptionPhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields. 3+ years direct experience in semiconductor thin film module, preferably in PECVD module. Good understanding of thin film deposition techniques and thin film property characterization is desired. Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired. Understanding of thin film tool hardware is advantageous. Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous. Possess good interpersonal and oral / written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
Roles & Responsibilities
Job Description :
- Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for advanced packaging applications.
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.
Job Requirements :
Tell employers what skills you have
Materials Science
Design of Experiments
Hardware
Physics
Property
Root Cause Analysis
Chemistry
Characterization
Packaging
Communication Skills
Film
Process Control
Electrical Engineering
Chemical Engineering
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Scientist • D05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG