Principal / Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Roles & Responsibilities

Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing : using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include :

Process Development :

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
• Upgrade process capabilities and reduce production costs
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.

Equipment and Materials :

Quality Improvement :

Collaboration and Coordination :

Requirements :

Tell employers what skills you have

MetaL

Technology Development

Quality Improvement

Defense

Physics

Manufacturing Processes

Artificial Intelligence

Product Engineering

Fabrication

Visual Basic

Process Management

SPC

Assembly

Process Control

Chemical Engineering

Mechanical Engineering