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Senior Scientist (Far BEOL – Advanced Process Modules), IME - A •STAR RESEARCH ENTITIES

Senior Scientist (Far BEOL – Advanced Process Modules), IME - A •STAR RESEARCH ENTITIES

A •STAR RESEARCH ENTITIESD05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG
10 days ago
Job description

Roles & Responsibilities

Job Scope

  • The candidate will be part of the Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME. His / Her main roles and responsibilities include :
  • Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
  • Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post-processing.
  • Drive innovations in process methodologies, materials, and approaches, and generate intellectual property related to heterogeneous integration platforms.
  • Collaborate with industry partners to align on and develop the building blocks required for next-generation heterogeneous integration platforms, including equipment capabilities.
  • Work closely with process integration teams to actively innovate, optimize bonding processes, and troubleshoot for industry and grant projects.
  • Lead and support competitive grant research project proposals and oversee their successful execution.
  • File patents and know-hows on new development activities.
  • Actively document and publish research findings in prestigious journals and conferences.

Job Requirements

  • PhD in Electronics, Microelectronics, Materials Engineering, Materials Science, Chemistry, Physics, or a related field .
  • Minimum of 5 years' industry experience in 3D heterogeneous integration and wafer bonding technologies, gained in either an academic or industrial setting.
  • Proven hands-on experience in wafer bonding with in-depth technical knowledge in at least one or more bonding processes and mechanisms (e.g., vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding).
  • Knowledge of silicon photonics or 3D heterogeneous integration technology platforms is preferred.
  • Strong skills in experimental design (DOE) and data analysis are preferred.
  • Demonstrated interpersonal skills with proven ability to collaborate with internal and external stakeholders.
  • At least 2 years of experience managing projects of moderate complexity is preferred.
  • Strong oral and written communication skills, with the ability to deliver clear and concise messages to diverse stakeholders.
  • Self-driven, with a strong interest in next-generation applications of wafer bonding technologies and awareness of industry trends.
  • Tell employers what skills you have

    Troubleshooting

    Data Analysis

    Interpersonal Skills

    Process Integration

    Physics

    3D

    Chemistry

    Experimental Design

    Intellectual Property

    Packaging

    Process Optimization

    Post Processing

    Silicon

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    Scientist • D05 Clementi New Town, Hong Leong Garden, Pasir Panjang, SG