Talent.com
This job offer is not available in your country.
Engineer, Advanced Packaging Wafer Level Technology Engineering

Engineer, Advanced Packaging Wafer Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
6 days ago
Job description

Roles & Responsibilities

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.

Key responsibilities and duties include :

Process Development :

  • Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
  • Upgrade process capabilities and reduce production costs
  • Establish and improve process management projects to deliver technology node requirements and scaling for next node.

Equipment and Materials :

  • Evaluate and promote new equipment and materials to enhance process capabilities
  • Set up process parameters for a variety of semiconductor equipment
  • Evaluate, promote, and plan for new equipment and materials
  • Quality Improvement :

  • Ensure defense coverage through process, measurement, inspection, and testing
  • Establish correlations between defense mechanisms to identify improvement opportunities
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
  • Collaboration and Coordination :

  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly / Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production
  • Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
  • Job Requirements :

  • Bachelor’s or advanced degree in Engineering or Science is required
  • Strong analytical, logical, and critical thinking skills
  • Effective communicator, able to collaborate across all levels
  • Growth mindset with a passion for continuous learning
  • Internship or experience in the semiconductor industry is a plus
  • Demonstrated leadership and a track record of impact are highly desirable
  • Interest in and knowledge of the semiconductor industry and Micron is preferred
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.
  • Experience with Visual Basic for automation and tool integration is preferred.
  • Embody Micron’s core values :

  • People – Respect, develop, and empower others
  • Innovation – Drive continuous improvement and breakthrough thinking
  • Tenacity – Show grit and determination
  • Collaboration – Build trust and foster teamwork
  • Customer Focus – Deliver excellence and value
  • What to Expect

    Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

    Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design / development engineering jobs.

    Tell employers what skills you have

    Modeling

    MetaL

    Technology Development

    Quality Improvement

    Defense

    Semiconductor Industry

    Critical Thinking

    Manufacturing Processes

    Product Engineering

    Fabrication

    Visual Basic

    Process Management

    Wellbeing

    Customer Focus

    Assembly

    Mapping

    Create a job alert for this search

    Engineer • D27 Yishun, Sembawang, SG

    Related jobs
    • Promoted
    Engineer, Advanced Packaging Wafer Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    Engineer, Advanced Packaging Wafer Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Die Level Technology Engineering - D27 Yishun, Sembawang, SG

    Engineer, Advanced Packaging Die Level Technology Engineering - D27 Yishun, Sembawang, SG

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Equipment Engineering

    Engineer, Advanced Packaging Equipment Engineering

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Integration Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    Engineer, Advanced Packaging Integration Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Adv Packaging Principal Yield Engineer

    Adv Packaging Principal Yield Engineer

    GLOBALFOUNDRIES SINGAPORE PTE. LTD.D25 Kranji, Woodgrove, Woodlands, SG
    GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology compa...Show moreLast updated: 3 days ago
    CQV Engineer (Filling & Packaging Systems)

    CQV Engineer (Filling & Packaging Systems)

    No deviationSingapore, Singapore
    Quick Apply
    At No deviation, we are dedicated to delivering patient-centric solutions that revolutionize the pharmaceutical landscape. As a dynamic expert in engineering consultancy, Commissioning Qualification...Show moreLast updated: 28 days ago
    • Promoted
    Engineer, Advanced Packaging Equipment Engineering - D27 Yishun, Sembawang, SG

    Engineer, Advanced Packaging Equipment Engineering - D27 Yishun, Sembawang, SG

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    URGENT!! Associate Engineer Process / Equipment (Wafer Fab exp is MUST) - WANCO MANPOWER PTE LTD

    URGENT!! Associate Engineer Process / Equipment (Wafer Fab exp is MUST) - WANCO MANPOWER PTE LTD

    WANCO MANPOWER PTE LTDIslandwide, SG
    The client is establishing a 300mm semiconductor wafer manufacturing facility in Singapore.Below position is open urgently. Associate Engineer (Process / Equipment).Employment Type : Permanent, Full-ti...Show moreLast updated: 6 days ago
    • Promoted
    6723 - Thermo-Compression Bonding (TCB) Design Engineer – Up to $8K | Advanced Packaging | 5-Day Work Week - D01 Cecil, Marina, People’s Park, Raffles Place, SG

    6723 - Thermo-Compression Bonding (TCB) Design Engineer – Up to $8K | Advanced Packaging | 5-Day Work Week - D01 Cecil, Marina, People’s Park, Raffles Place, SG

    THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG
    Position title : TCB (Thermo Compression Bonding) Design Engineer.Working hours : 9 : 00am - 6 : 00pm.Salary : $6000 - $8000 (depends experience). A TCB Design Engineer is responsible for designing, dev...Show moreLast updated: 3 days ago
    • Promoted
    Engineer, Advanced Packaging Die Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    Engineer, Advanced Packaging Die Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    6723 - Precision Design Engineer (TCB Bondhead & Stage Modules) – Semiconductor Packaging | $6K–$8K

    6723 - Precision Design Engineer (TCB Bondhead & Stage Modules) – Semiconductor Packaging | $6K–$8K

    THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG
    Position title : TCB (Thermo Compression Bonding) Design Engineer.Working hours : 9 : 00am - 6 : 00pm.Salary : $6000 - $8000 (depends experience). A TCB Design Engineer is responsible for designing, dev...Show moreLast updated: 3 days ago
    • Promoted
    6723 - Semiconductor Equipment R&D Engineer (TCB Focus) – CREO + Advanced Materials | Up to $8K

    6723 - Semiconductor Equipment R&D Engineer (TCB Focus) – CREO + Advanced Materials | Up to $8K

    THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG
    Position title : TCB (Thermo Compression Bonding) Design Engineer.Working hours : 9 : 00am - 6 : 00pm.Salary : $6000 - $8000 (depends experience). A TCB Design Engineer is responsible for designing, dev...Show moreLast updated: 3 days ago
    • Promoted
    Engineer, Advanced Packaging Die Level Technology Engineering

    Engineer, Advanced Packaging Die Level Technology Engineering

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Integration Engineering

    Engineer, Advanced Packaging Integration Engineering

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Wafer Level Technology Engineering - D27 Yishun, Sembawang, SG

    Engineer, Advanced Packaging Wafer Level Technology Engineering - D27 Yishun, Sembawang, SG

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    Engineer, Advanced Packaging Equipment Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    Engineer, Advanced Packaging Equipment Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago
    • Promoted
    6723 - Thermo-Compression Bonding (TCB) Design Engineer – Up to $8K | Advanced Packaging | 5-Day Work Week

    6723 - Thermo-Compression Bonding (TCB) Design Engineer – Up to $8K | Advanced Packaging | 5-Day Work Week

    THE SUPREME HR ADVISORY PTE. LTD.D01 Cecil, Marina, People’s Park, Raffles Place, SG
    Position title : TCB (Thermo Compression Bonding) Design Engineer.Working hours : 9 : 00am - 6 : 00pm.Salary : $6000 - $8000 (depends experience). A TCB Design Engineer is responsible for designing, dev...Show moreLast updated: 3 days ago
    • Promoted
    Engineer, Advanced Packaging Integration Engineering - D27 Yishun, Sembawang, SG

    Engineer, Advanced Packaging Integration Engineering - D27 Yishun, Sembawang, SG

    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.D27 Yishun, Sembawang, SG
    Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-dr...Show moreLast updated: 6 days ago