Engineer, Advanced Packaging Die Level Technology Engineering - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Roles & Responsibilities

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.

Key responsibilities and duties include :

Process Development :

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Establish and improve process management projects to deliver technology node requirements

Equipment and Materials :

Quality Improvement :

Collaboration and Coordination :

Job Requirements :

Embody Micron’s core values :

What to Expect

Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design / development engineering jobs.

Tell employers what skills you have

Sustainability

Modeling

Technology Development

Quality Improvement

Semiconductor Industry

Manufacturing Processes

Product Engineering

Fabrication

Visual Basic

Process Management

Packaging

Assembly Processes

Customer Focus

Product Development

Assembly

Manufacturing