Looking to advance your career in the semiconductor industry? Join a leading semiconductor company in Singapore and be part of an innovative, high-growth environment.
Interview Location: Melaka (By Invitation Only) Interview Date: 4 July 2026
Open Positions:
Equipment Associate Engineer – Die Preparation / Recon
Process Associate Engineer – Die Preparation / Molding / Pick & Place
What We Offer:
Salary: SGD 3,000 – 4,800 (based on experience and qualifications).
Work Schedule: 4-day work week, 12-hour rotating shifts.
Shift Allowance: Day Shift SGD 15/day | Night Shift SGD 30/day.
AWS (13th Month Bonus).
Performance Bonus
Medical & Dental Benefits
Overtime Pay for Rest Day Work
Requirements:
Diploma/Degree in Engineering or a related field.
Prior semiconductor industry experience is required.