Senior Advanced Packaging Application Engineer | TCB {hkhdv}

THE SUPREME HR ADVISORY PTE. LTD. • Islandwide, SG

16 hours ago

Job description

Roles & Responsibilities

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Location: Woodlands/Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

Customer Application Engineering

Understand customer packaging roadmaps and manufacturing requirements.
Translate process requirements into equipment specifications.
Participate in customer technical discussions and application reviews.
Support technical sales activities and customer demonstrations.
Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

-Develop and support applications involving:

Thermo Compression Bonding (TCB)
Flip Chip Assembly
Hybrid Bonding
HBM Packaging
CoWoS
CoPoS
2.5D Packaging
3D Packaging
Chiplet Integration
Large Die Packaging

-Evaluate and optimize:

Bond force
Temperature profiles
Process windows
Alignment accuracy
Package warpage
Yield
Reliability

Equipment Development

-Work closely with multidisciplinary engineering teams to define:

Machine architecture
Functional specifications
Accuracy requirements
Throughput targets
Thermal performance
Bonding process capability
Reliability requirements
Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

Defining machine acceptance criteria
Process qualification
FAT and SAT support
Customer buyoff support
Qualification reporting
Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

Advanced packaging technologies
Semiconductor manufacturing trends
Customer requirements
Competitor equipment
Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

Materials Engineering
Mechanical Engineering
Electrical Engineering
Chemical Engineering
Physics
Semiconductor Engineering
Related Engineering disciplines

-Minimum 5 years experience in semiconductor advanced packaging.

-Hands-on experience in one or more of the following:

Thermo Compression Bonding (TCB)
Advanced Packaging Process Development
Flip Chip Assembly
New Product Introduction (NPI)
Process Qualification
Equipment Qualification
Manufacturing Engineering
Customer Process Development

- Experience supporting advanced package technologies such as:

HBM
CoWoS
CoPoS
Chiplets
2.5D Packaging
3D Packaging
Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

Thermo Compression Bonding (TCB)
Semiconductor Packaging
Flip Chip Assembly
Process Qualification
SPC
DOE
Yield Improvement
Reliability Testing
Failure Analysis
Package Warpage
Thermal Management
Alignment Accuracy
Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.

Interested applicants can also send your resume to WA:+65 88141540 (Dominic) and allow our Consultant to match you with our Clients. There are more related or other job to match as well.

No Charges will be incurred by Candidates for any service rendered.

Ho Kay Heng Dominic Reg No: R26162365 | The Supreme HR Advisory Pte Ltd EA No: 14C7279

Tell employers what skills you have

Packaging Requirements
Medical Degree
Technical Customer Support
Physics
Translate Into Technical Requirements
Applications Development
Materials Engineering
Customer Development
PCB Design
Cadence
Supporting Sales Activities
Electrical Engineering
Chemical Engineering
Mechanical Engineering
Customer Feedback
Semiconductor Technology

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