[2868] Process / Application Engineer (Die Bond Tools | Woodlands)

Roles & Responsibilities

• Working Location: Woodlands North Coast
• Working Days: Monday – Friday
• Working Hours: 9:00am -6:00pm
• Starting Salary: $3,000 to $6,000

Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations (as required).

Lester Ong Yu Xuan | Reg No : R26162868

The Supreme HR Advisory Pte Ltd | EA No. : 14C7279

Tell employers what skills you have

Process Improvement and Optimisation
Electronics Packaging
Design
promote travel products
Research & Development
Tools Development
Tool Design
Problem Solving
Process Documentation
Process Optimisation
Motion Control
Packaging Engineering
Electrical Engineering (including power engineerin
Wire Bonding
Calibration