Roles & Responsibilities
Responsibilities:
Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on Focused Ion Beam (FIB) and one or more of the following:
Atomic Force Microscopy (AFM)
Optical interferometry or White Light Interferometry (WLI)
Scanning Electron Microscopy (SEM)
Semiconductor electrical or non-contact characterization methods
Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related characterization techniques to close inline detection gaps and accelerate process learning.
Lead the evaluation, qualification, and deployment of next-generation metrology systems and First-of-a-Kind (FOAK) technologies, including assessment of measurement capability, accuracy, repeatability, throughput, automation, and manufacturing readiness across FIB, AFM, SEM, and other advanced metrology platforms.
Establish and drive technology roadmaps, ensuring alignment with future NAND technology requirements while fostering strong technical partnerships with equipment suppliers and industry collaborators.
Identify and develop modeling opportunities using metrology, defect detection, artificial intelligence (AI), and machine learning (ML) techniques in conjunction with metrology data analytics to understand electrical failure signatures observed at probe and their impact on product reliability, yield, and performance.
Collaborate closely with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to develop innovative characterization solutions and enable rapid technology deployment
Qualifications:
Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.
Minimum 7 years of semiconductor metrology development experience with demonstrated ownership and experience developing new metrology applications, recipes, methodologies or inline monitoring solutions across advanced characterization platforms, including FIB and one or more of the following: AFM, SEM, or WLI (not users of Metrology data).
Minimum 5 years of hands-on experience in Focused Ion Beam (FIB) and at least one additional advanced metrology technique from the following
Atomic Force Microscopy (AFM)
While Light Interferometry (WLI)
Scanning Electron Microscopy (SEM)
Demonstrated track record developing advanced semiconductor metrology applications for process characterization, inline monitoring, root-cause analysis, yield improvement, reliability investigations, and technology transfer, including qualification of new metrology technologies and direct engagement with suppliers to establish application capability and technology roadmaps.
Candidates whose experience is primarily limited to process engineering, yield engineering, failure analysis, or data analysis roles without direct metrology application development responsibility will not be considered.
Tell employers what skills you have
Scanning Electron Microscopy
FIB
AFM
manufacturing environment
Applied Physics
Technical Requirements
Supplier Development
Metrology and Inspection in Advanced Manufacturing
Data Governance
Atomic Force Microscopy
Interferometry
Materials Engineering
Identify process gaps
Semiconductors
Electrical Engineering
Failure Analysis
Senior Engineer, NTI Metrology • D27 Sembawang, Yishun, SG
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