Laser-Assisted Bonder process engineer | Semiconductor - SS10 - D01 Cecil, Marina, People’s Park, Raffles Place, SG

Roles & Responsibilities

Position title : Laser-Assisted Bonder (LAB) process engineer

Location : Admiralty

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization : Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification : Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management : Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support : Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement : Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation : Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration : Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance : Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support : Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have) : Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

Samuel Siaw | Reg No : R2412474

The Supreme HR Advisory Pte Ltd | EA No : 14C7279

Tell employers what skills you have

Recipes

Materials Science

FMEA

Stress

Technology Transfer

Throughput

Program Management

Technical Training

KEE

SPC

PFMEA

Six Sigma

Calibration

Advanced Process Control

Minitab