THE SUPREME HR ADVISORY PTE. LTD. - TCB Design Engineer (Semiconductor Packaging / Plasma Modules / Die Handling ) - YZ11

Roles & Responsibilities

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location : Admiralty Street

Working Days : 5 Day A Week

Working hours : 9 : 00am - 6 : 00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have :

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature / power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have :

Required Skills and Qualifications

Interested applicants, WA your resume to ‪‪‪‪+65 9136 9792‬‬‬‬ or email your resume to supreme.yentan@gmail.com.

TAN YEN ZHEN (CHEN YANZHEN) REG NO : R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO : 14C7279

Tell employers what skills you have

Compression

Materials Science

Semiconductor Materials

FMEA

Quality Management

Stress

Semiconductor Manufacturing

Contamination Control

Throughput

3D

Fabrication

IP

Packaging

Semiconductors

Packaging Engineering

Simulations

Windchill

Assembly

CAD

Minitab