Senior Research Engineer (Heterogeneous Integration),(IME)

About Us : The Institute of Microelectronics (IME) is a global

leader in semiconductor innovation, specializing in advanced wafer

level packaging. Our research focuses on pioneering platforms such

as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D / 3D

packaging, and co-packaged optics, essential for the next

generation of heterogeneous chiplet integration. At IME, you'll

have access to state-of-the-art packaging equipment and be at the

forefront of

transformative

research.

Position Overview : We are seeking a

highly skilled and motivated Research Engineer to drive the

development and optimization of advanced wafer level packaging

processes. This role offers the opportunity to work on

groundbreaking technologies and contribute to high-impact projects

that push the boundaries of semiconductor

packaging.

Requirements :

Educational Background : Master's or Bachelor's degree in

Materials Science, Mechanical Engineering, Physics, Chemistry,

Electronics, or Electrical Engineering.

Experience : Hands-on experience in process development or

packaging R&D. A proven track record in advanced packaging

technologies will be an added

advantage.

Key

Responsibilities :

Innovative Process Development : Lead the design and

development of advanced assembly processes, including 2.5D / 3D

packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid

bonding.

Evaluation and Characterization :

Plan, coordinate, and execute comprehensive evaluations of

processes, equipment, and materials. Drive the development of new

process qualifications and establish manufacturing

guidelines.

Project Collaboration : Partner

with project leaders to align on requirements and enhance

capabilities to meet evolving project needs.

Intellectual Property and Reporting : Prepare detailed

engineering reports and contribute to the development of new

intellectual properties (IPs) and knowledge areas (KHs),

strengthening the IP portfolio in heterogeneous

integration.

Customer and Market Engagement :

Engage with internal and external stakeholders to anticipate future

demands and develop the capabilities required to address

them.