Senior Research Engineer (Heterogeneous Integration),IME

Job Title : Heterogenous Integration Research

Engineer

About

Us : The Institute of Microelectronics (IME) is a

global leader in semiconductor innovation, specializing in advanced

wafer level packaging. Our research focuses on advanced packaging

such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D / 3D

packaging, and co-packaged optics. At IME, you'll have access to

state-of-the-art packaging equipment and be at the forefront of

transformative research.

Position

Overview : We are seeking a highly motivated Research

Engineer to drive the development of advanced packaging processes.

This role offers the opportunity to work on innovative technologies

and contribute to high-impact projects that push the boundaries of

semiconductor packaging.

Key

Responsibilities : Innovative Process

Development : Lead the design and development of

advanced assembly processes for 2.5D / 3D packaging, Fan-Out

Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.

Evaluation and

Characterization : Coordinate and execute

comprehensive evaluations of processes, equipment, and materials.

Develop and implement new process qualifications and establish

manufacturing guidelines.

Project Collaboration : Work

closely with project leaders to align on project requirements.

Develop and enhance capabilities to meet evolving project

needs.

Intellectual Property and

Reporting : Generate detailed engineering reports and

contribute to the creation of new intellectual properties (IPs) and

knowledge areas (KHs). Strengthen the IP portfolio related to

heterogeneous integration.

Customer and Market

Engagement : Collaborate with internal and external

stakeholders to understand future demands and develop the necessary

capabilities to meet these

needs.

Requirements :

Educational Background :

Master's degree or bachelor's degree in Materials Science,

Mechanical Engineering, Physics, Chemistry, Electronics, or

Electrical Engineering.

Experience : Experience in

process development or packaging R&D, with a strong track

record in advanced packaging technologies is added

advantage.