Head of TCB Process Engineering — Bonding Innovation & EquityPyxis CF • Singapore, Singapore, Singapore
Head of TCB Process Engineering — Bonding Innovation & Equity
Pyxis CF • Singapore, Singapore, Singapore
2 days ago
Job description
A semiconductor packaging technology firm based in Singapore is seeking a Head of Process Engineering. The role involves leading the development and qualification of bonding processes for advanced semiconductor packaging. Candidates should have over 8 years of experience in TCB or Hybrid Bonding, strong leadership skills, and a relevant degree. Competitive compensation includes bonuses and equity participation.
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Head Of Engineering • Singapore, Singapore, Singapore
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