Head of Process Engineering – Thermo-Compression Bonder Systems

About PYXIS CF

PYXIS CF Pte Ltd is a Singapore-based developer of next‑generation Thermo‑Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D / 3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our technical leadership team to accelerate the Alpha build of our HBM‑class TCB platform targeted for 2026.

Position Overview

The Head of Process Engineering will lead the definition, development, and qualification of next‑generation TCB bonding processes and their translation into equipment capability requirements.

The role requires deep hands‑on experience in flux‑less thermal compression bonding, formic‑acid / N₂ environments, and precision die‑to‑substrate assembly at fine pitch (

This position reports directly to the CEO and will collaborate closely with the Head of Equipment Engineering and software control teams.

Key Responsibilities

• Lead process development for flux‑less Thermo‑Compression Bonding (TCB) for advanced packaging (HBM, CoWoS, 2.5D / 3D).
• Define critical‑to‑quality (CTQ) parameters and Design Validation Plan & Report (DVP&R) frameworks for bonding yield, die tilt, and warpage control.
• Establish and maintain formic‑acid bonding environment and N₂ tunnel process standards.
• Correlate process responses with equipment parameters (Z‑axis control, force‑temperature loops, heater uniformity, clamping pressure).
• Develop and own process FMEA, SPC, and predictive maintenance metrics.
• Interface with customers and partners (e.g. Micron Singapore, regional OSATs) for process qualification and yield improvement.
• Coach and build a local team of process and integration engineers; drive knowledge transfer and documentation.
• Collaborate with mechanical, control, and software groups to ensure process requirements are translated into tool specifications.
• Contribute to patent generation and technical papers on bonding process innovation.

Requirements

Preferred / Advantageous

Location

Singapore – PYXIS CF R&D Centre (Cleanroom & Lab Facility)

Compensation

Competitive senior‑engineering package commensurate with experience, including performance bonus and participation in the company’s equity program.

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