Senior Scientist (PECVD Module for Advance Packaging) (APM),IME

Job

Description : Develop

and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD)

process for advanced packaging applications.

Characterize thin film properties and troubleshoot

process-related issues to ensure quality and

performance.

Serve as a subject matter expert,

supporting integration teams with technical insights and

recommendations.

Collaborate with fab teams to

implement and maintain statistical process control (SPC) for thin

film modules.

Prepare and deliver technical

reports and presentations for both internal stakeholders and

external

customers.

Job

Requirements : PhD in

Materials Science, Electrical Engineering, Chemical Engineering,

Physics, Chemistry, and Microelectronics, or related

fields.

3+ years direct experience in

semiconductor thin film module, preferably in PECVD

module.

Good understanding of thin film

deposition techniques and thin film property characterization is

desired.

Hands-on experience in Design of

Experiments (DOE) methodologies, statistical root cause analysis,

and problem-solving methods is desired.

Understanding of thin film tool hardware is

advantageous.

Hands-on experience with basic

process characterization techniques such as DRSEM, CDSEM, HRTEM and

Ellipsometry is advantageous.

Possess good

interpersonal and oral / written communication skills, with ability

to deliver clear and concise messages to both internal and external

stakeholders.