Senior Scientist (Far BEOL - Advanced Process Modules),IME

Job Scope

The candidate will be part of the Far-Backend of Line

(Far-BEOL) process module team, advancing specialty

microelectronics technologies at IME. His / Her main roles and

responsibilities include :

Develop

Chip-to-Wafer (C2W) bonding process capabilities using fusion,

hybrid, thermocompression, and eutectic bonding for photonics

heterogeneous integration and advanced packaging

applications.

Lead module loop integration for

layer transfer of III-V and other compound materials through C2W

bonding and post-processing.

Drive innovations

in process methodologies, materials, and approaches, and generate

intellectual property related to heterogeneous integration

platforms.

Collaborate with industry partners

to align on and develop the building blocks required for

next-generation heterogeneous integration platforms, including

equipment capabilities.

Work closely with

process integration teams to actively innovate, optimize bonding

processes, and troubleshoot for industry and grant

projects.

Lead and support competitive grant

research project proposals andoversee their successful

execution.

File patents and know-hows on new

development activities.

Actively document and

publish research findings in prestigious journals and

conferences.

Job

Requirements

PhD in

Electronics, Microelectronics, Materials Engineering,

Materials Science, Chemistry, Physics, or a related

field .

Minimum of 5 years'

industry experience in 3D heterogeneous integration and wafer

bonding technologies, gained in either an academic or industrial

setting.

Proven hands-on experience in wafer

bonding with in-depth technical knowledge in at least one or more

bonding processes and mechanisms (e.g., vacuum bonding, metal-metal

bonding, fusion bonding, hybrid bonding, temporary

bonding).

Knowledge of silicon photonics or 3D

heterogeneous integration technology platforms is

preferred.

Strong skills in experimental

design (DOE) and data analysis are preferred.

Demonstrated interpersonal skills with proven ability to

collaborate with internal and external stakeholders.

At least 2 years of experience managing projects of

moderate complexity is preferred.

Strong oral

and written communication skills, with the ability to deliver clear

and concise messages to diverse stakeholders.

Self-driven, with a strong interest in next-generation

applications of wafer bonding technologies and awareness of

industry trends.